Wake Forest University
Microscopy and Microanalysis
The Microscopy and Microanalysis tools at WFU require training and clearance by the facility manager. User workshops and classes are offered regularly through the Nanotechnology Center. Assistance using the microscopes is available and full microscopy services are available through the various Nanotech Center Groups.
Typical User Fees: $ 50/hour for faculty and staff
$100/hour for off campus users
image sourced online
JEOL 2010F STEM
(1) Cameras and Detectors (i) Gatan MultiScan Camera (model 794) & MultiScan Camera (model 794 IF); (ii) Fischione HAADF detector (iii) Oxford EDS detector (iv) Gatan GIF 2000 EELS spectrometer (2) Sample holders (i) JEOL single-tilt holder, (ii) JEOL double-tilt holder, Model: EM-31041 (iii) GATAN 912 Ultra High Tilt Tomography Holder, Model: 912.J2915, (iv) GATAN 636 Cooling In-situ Holder, Model: 636-J0915J03.
JEOL 1200 EX CTEM
Resolution 0.3 nm (point), 0.14 nm (line) Magnification range: 50x - 1,000,000x, AMT XR-80 TEM Digital Camera Series: large 8 Megapixel CCD Sensor 50 MHz High Speed, Low Noise Readout GigE Interface
JEOL 6335F SEM
Electron beam energy: 0.2-40 keV, Resolution: 1.5 nm, Magnification: 500,000x, 3D imaging package, Sputter coater and carbon coater available. Energy dispersive spectrometer (EDS), X-Ray range: 0.15-40 keV Energy resolution.
JEOL JSPM 5200 Atomic Force Microscope
The JSPM-5200 can be used in air, controlled atmosphere, fluid, or vacuum at temps of of 500° C (773K) to -143° C (130K). It can be configured as an AFM or STM. STM modes include CITS, I-V, S-V, and I-S. Standard AFM modes include contact, friction force microscopy, current image, non-contact and discrete contact with either slope detection or frequency detection, and phase imaging.
RHK UHV VT Scanning Tunneling Microscope
This RHK Technology, Inc microscope is equipped with a VT cryostat an ultra high vacuum system designed and built by Duniway Stockroom Corp and a vibration isolation system with a custom Newport air suspension system. The STM is based on a "Besoke" scanner, flow LHe cryostats and sealed heating filaments for temperature control down to 10 K and up to 1000 K.
XPS / AUGER
PHI 570 Scanning Auger and XPS system
X-Ray Photoelectron Spectroscopy (XPS) Surface Analysis / ESCA and Auger Electron Spectroscopy (AES)
Description from PHI
X-ray Photoelectron Spectroscopy (XPS)... What is X-ray Photoelectron Spectroscopy (XPS)? XPS, also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. The sample is irradiated with mono-energetic x-rays causing photoelectrons to be emitted from the sample surface. An electron energy analyzer determines the binding energy of the photoelectrons. From the binding energy and intensity of a photoelectron peak, the elemental identity, chemical state, and quantity of an element are determined. The information XPS provides about surface layers or thin film structures is of value in many industrial applications including: polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, magnetic media, and thin film coatings used in a number of industries.
Auger Electron Spectroscopy (AES)… What is AES? Auger Electron Spectroscopy (AES) is an analytical technique that uses a primary electron beam to probe the surface of a solid material. Secondary electrons that are emitted as a result of the Auger process are analyzed and their kinetic energy is determined. The identity and quantity of the elements are determined from the kinetic energy and intensity of the Auger peaks. The nature of the Auger surface analysis process is such that Auger electrons can only escape from the outer 5-50 Å of a solid surface at their characteristic energy. This effect makes AES an extremely surface sensitive technique. A finely focused electron beam can be scanned to create secondary electron and Auger images, or the beam can be positioned to perform microanalysis of specific sample features. Applications include materials characterization, failure analysis, thin film analysis, and particle identification for semiconductor and thin film head manufacturing.