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the Wake Forest University - Nano and Quantum Technologies Laboratory

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Sample prep lab
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JEOL 6330F
Hitachi 4700 F
Hitachi 3000
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RHK VT SPM100
JEOL 5200 SPM
DI/Veeco 3100 SPM
PHI XPS
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Olympus Vanox DIC
Olympus Vanox Fluor.
PHI 570 Scanning Auger and XPS system
X-Ray Photoelectron Spectroscopy (XPS / ESCA) and Auger Electron Spectroscopy (AES)
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The NANOTEQ XPS/AUGER system is an older system that has been rebuilt and upgraded by RBD instruments in California. Further upgrades and modifications have been made by the NanoFabrik engineering team here at NANOTEQ. These upgrades include changes to the vacuum system, sample exchange, new X-ray systems, and Auger CCD alignment system, along with a new sputter system. The system is highly effective in a wide variety of surface analysis functions.
Instrumental resolution:
Energy - 0.5 eV
2D elemental mapping - 100 microns
Base pressure - 2 x 10 (-11) torr
Excitation: Al K-alpha line Ex = 0.25 eV
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Microscope: PHI 570
​Service contractor: RBD
Manager: Carroll​
Location: ​ RM06 microscopy
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X-ray Photoelectron Spectroscopy (XPS), also known as ESCA, is the most widely used surface analysis technique because of its relative simplicity in use and data interpretation. The sample is irradiated with mono-energetic x-rays causing photoelectrons to be emitted from the sample surface. An electron energy analyzer determines the binding energy of the photoelectrons. From the binding energy and intensity of a photoelectron peak, the elemental identity, chemical state, and quantity of an element are determined. XPS provides information about surface layers or thin film structures, polymer surface modification, catalysis, corrosion, adhesion, semiconductor and dielectric materials, electronics packaging, and magnetic media.
Auger Electron Spectroscopy (AES) is an analytical technique that uses a primary electron beam to probe the surface of a solid material. The kinetic energy of the secondary electrons emitted as a result of the Auger process is analyzed. This fingerprints the identity and quantity of the surface elements. Auger surface analysis is sensitive to only the outer 5-50 Å of a solid surface. A finely focused electron beam can be scanned to create secondary electron and Auger images, or the beam can be positioned to perform microanalysis of specific sample features. Applications include materials characterization, failure analysis, thin film analysis, and particle identification for semiconductor and thin film head manufacturing.