NanoteQ
Inorganics Cluster
IMF
Lithography
Karl Suss MJB3 Mask Aligner
3" masks 300 W 365 nm UV
(1990's) updated with digital imaging new light source and rebuilt staging
FEI 200M FIB
Magnum column: 5-30kV, Milling power: 21nA beam current, CDEM for ions and electron images with 7nm resolution, Windows OS and FEI UI; TSS networking computer, 5-axis, comp-eucentric tilt stag, Full coverage of 70mm diameter, Motorized XYZ: 25 x 25 x 25mm x Rotation x 360° x Manual T -15° +60, Chamber scope, Gas Injection System: 2 injectors
(2005 ISS rebuild 2024)
Nabity NPGS direct write electron beam lithography system mounted on a JEOL 6330F with an Oxford Inca EDS system for substrate characterization. (2005 system)
Laurell resist spinner and SCS P6700 programmable spinning system (2020)
DPN 2000 dip pen lithography system (2010)
Assorted Light Boxes for making PCBs
Optical reducing system for mask fabrication. House designed and built. Used for creating speciality masks
Assorted setting vacuum ovens for processing resist
Deposition
3X Thermal Evaporators
Edwards general purpose metals
House Built general purpose organics
Seiko glovebox mounted general
Kurt Lester Nano 36 AC/DC magnetron sputtering system Multiple targets available. (2015)
Oxford Plasma pro plus PECVD system with 400 cm platten and 6 gas lines. 300W RF. (2010)
e beam evaporator
currently being installed...
Plasma Processing
Anatech Hummer X bench top plasma etcher/asher with Ar or O2 process gas
Oxford Plasma pro plus reactive ion etcher (RIE) with multiple process gases available.
UVOC ozone cleaner for Is/SiO substrates.