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Nanote
Inorganics Cluster 

 

IMF

Lithography

Karl Suss MJB3 Mask Aligner

3" masks 300 W 365 nm UV

(1990's) updated with digital imaging new light source and rebuilt staging

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FEI 200M FIB 

Magnum column: 5-30kV, Milling power: 21nA beam current, CDEM for ions and electron images with 7nm resolution, Windows OS and FEI UI; TSS networking computer, 5-axis, comp-eucentric tilt stag, Full coverage of 70mm diameter, Motorized XYZ: 25 x 25 x 25mm x Rotation x 360° x Manual T -15° +60, Chamber scope, Gas Injection System: 2 injectors
(2005 ISS rebuild 2024)

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Nabity NPGS direct write electron beam lithography system mounted on a JEOL 6330F with an Oxford Inca EDS system for substrate characterization. (2005 system)

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Laurell resist spinner and SCS P6700 programmable spinning system (2020)

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DPN 2000 dip pen lithography system (2010)

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Assorted Light Boxes for making PCBs

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Optical reducing system for mask fabrication. House designed and built. Used for creating speciality masks

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Assorted setting vacuum ovens for processing resist

Deposition

3X Thermal Evaporators

Edwards general purpose metals

House Built general purpose organics

Seiko glovebox mounted general

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Kurt Lester Nano 36 AC/DC magnetron sputtering system Multiple targets available. (2015)

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Oxford Plasma pro plus PECVD system with 400 cm platten and 6 gas lines. 300W RF. (2010)

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e beam evaporator

currently being installed...

Plasma Processing

Anatech Hummer X bench top plasma etcher/asher with Ar or O2 process gas

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Oxford Plasma pro plus reactive ion etcher (RIE) with multiple process gases available.

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UVOC ozone cleaner for Is/SiO substrates.

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