Wake Forest University
Tools in FabLab
Karl Suss MJB3 Mask Aligner UV0200: This system is a recently rebuilt and upgraded, mechanical mask aligner for 3" wafers. It has backside mask alignment using IR camera and source, digital imaging of the samples, and 0.3 um line resolution is possible but ~1 micron is more typical depending on the user, setup conditions and mask mode. Lamp is 350 W Cd/Xe 210 nm - 230 nm emission.
Karl Suss MJB3 Mask Aligner Standard (0400) The system is rebuilt and upgraded, mechanical, with ~ 1 um to 1.25 um resolution. A 200W illumination with 365 406 435 nm lines. This general purpose system is robust, easy to use and is generally used for training, organic devices, and larger monolith.
Karl Suss MJB3 Mask Aligner UV0300. This system is a recently rebuilt and upgraded, mechanical mask aligner. 3" wafers, top side alignment only. ~1 um resolution typical, 0.8 um resolution under ideal conditions. 315 335 365 um lines at 350 nm from a Hg/Xe lamp.
Focussed Ion Beam: FIB is a FEI 200M with a rebuild and service from TSS.
• Magnum column: 5-30kV
• Milling power: 21nA beam current
• CDEM for ions and electron images with 7nm resolution
• Windows OS and FEI UI
• 5-axis, comp-eucentric tilt stage
• Full coverage of 70mm diameter
• Motorized XYZ: 25 x 25 x 25mm x Rotation x 360° x Manual T -15° +60
• Front door load
• Chamber scope for real time observation
• Gas Injection System: Max 4 injectors, 2 included; chemistry of choice
• Vacuum system: column IGP, air cooled turbo and mechanical PVP
Nabity NPGS: e-beam lithography built on a Zeiss Supra 25 with Schottky Field emission gun. System also has EDAX system.
Laurell Resist Spinner #2 programmable spinner set up for etch resistant resists such as Zep 520 or ma-N 2400.
Laurell Resist Spinner #1: programmable spinner set up for standard use resists such as SU8,
Wet Benches: Si wet process bench, acid and base hoods, refrigerated storage, and vented chemical storage. RM 107 does NOT provide for general sample storage so users will need to keep samples with them.
AC/DC Sputtering Kurt Lesker Nano 36. This is a well maintained workhorse system.
NOS, Ar and O2 gasses.
metal and ceramic targets allowed
based pressure 10-6
semi-clean
Reactive ion etcher (RIE): Oxford plasma 80 plus. gasses: CF4 and O2. This system is used for structural refinement, and/or etch removal of substrate in circuit designs.
PECVD system: Oxford Plasma 80 Plus. Gases: SiH4, NH3, and N2. This is used for hard mask formation primarily (SNx) but can also be configured for dielectric thin films. The system is setup for simple "few step" processes currently.
e Beam Evaporator Kurt Lesker, cryopumped AXXIS system with e-beam evaporation, and two sputter sources. The AXXIS allows for co-sputtering as well as ebeam evaporation. There is even a thermal source on the system.
Gases O2 Ar NOS
Metal targets only
base pressure 10 -10
clean
Wake Forest Environmental Management System (WFEMS): All gasses within the cleanroom used for processing of materials are managed by the WFEMS - gas manifold system for safety and effective delivery. This system manages gasses to all sputter, plasma, evaporative systems as well as the cleanroom environment. It is equipped with a variety of safety interlocks so if you need help with it, please seek a superuser.
Ion Mill: US Gun II based Ion Mill. Ion milling is a dry etching method used for creating thin film patterns. Our process gas is Ar and It is used to bombard the areas of a sample uncovered by a hard mask. This method is superior to wet chemical etching and lift-off process because it does not involve chemical reactions or film straining. It allows removal of layers of materials with atomic precision and can form nano-sized patterns. (on AXXIS system)
Anatech HUMMER V: Ar / O2 plasma etcher/asher used for basic rough washing and etching jobs.
Mask design software: used to design masks and allows circuit simulation. While Rm98 can produce dies and PCB's we do not make our own masks typically. There are a number of mask sources and we submit designs to them with a 1 week turn around time generally.